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IC Back-End Engineer

2-3.5万·15薪
  • 合肥蜀山区
  • 1-3年
  • 硕士
  • 全职
  • 招1人

职位描述

数字后端设计数字芯片
Job Description:
1. Responsible for SOC chip-level and sub-system level integration task.
2. SOC/sub-system hierarchical architecture plan, RTL design rule check, RTL synthesis, equivalent check, timing sign-off, timing ECO, low power design rule check, performance/power/area quality boost, and etc.
3. Support chip-level/sub-system physical implementation, including floorplan, power plan, placememt, clock tree synthesis, routing, LVS/DRC, and etc.

Job requirements:
1. MSEE degree or above in microelectronics, computer, electronic engineering, communication engineering, and other related fields.
2. Familiar with Verilog and ASIC front-end design flow, with solid digital circuit theory foundation, hands-on ability and innovation ability.
3. Professional in IC EDA tools(such as Spyglass/Genus/DC/PT/LEC/CLP/DFTC/TestMax/Tessent/Innovus/ICC and etc), and with ASIC design experience, such as RTL coding, Synthesis, P&R, STA timing sign-off, IR Analysis Post-silicon diagnosis and etc.
4. Familar with scripting language, such as Makefile/Tcl/Perl/Python, and etc.
5. Good communication and team-work skills, good English communication and presentation experience.
6. Passion work attitude, full of curiosity about technology, courage to take responsibility, and able to work under strong pressure.

Work location:
合肥Hefei (MHF site)

Required seniority of this role:
1. 3+ years SOC digital design/integration/physical design related experience.
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工作地点

蜀山区联发科技(合肥)有限公司

职位发布者

袁先生/经理

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联发科技
联发科技股份有限公司——创立于公元1997年,世界顶尖的IC专业设计公司,位居全球消费性IC芯片组领航地位。成立至今,积极投注研发资源,发展高阶消费性IC完整方案,产品领域覆盖数码消费、数字电视、光储存、无线通讯等系列,被美国《福布斯》杂志评为“亚洲企业50强”,是亚洲唯一连续六年蝉联全球前十大IC设计公司的唯一的华人企业。全球机构遍及台湾、深圳、合肥、北京、美国硅谷、洛杉矶、印度孟买、新加坡、日本、韩国等。
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