职责描述：
1.负责化学机械研磨和电化学无应力抛光设备测试研发和创新；
Responsible for CMP and electrochemistry test, research, development and innovation;
2.负责化学机械研磨与无应力抛光设备集成的测试，研发和创新；
Responsible for CMP and SFP integrated process test, research, development and innovation;
3.负责机台日常维护测试，测试和可靠性测试；
Responsible for tool daily maintenance，test and reliability test;
4.负责设备相关技术文献检索，分析和撰写；
Responsible for relevant technology document search, analysis and writing;
5.与机械，电气，软件工程师合作，负责机台设计，评估，测试，和改进
Responsible for coworking with mechanical, electrical, software engineers to support tool design, evaluation, test, and improvement;
6.与客户合作，安装，调试，验收机台以及维保
Cooperate with customer to install，evaluate，qualify tool and maintenance，service.
任职要求：
1. 5-8年CMP先进封装FAB、或设备厂商设备工作经验；
5~8years working experience in related field such as CMP equipment in FAB or in an advanced packaging factory or tool vendors;
2. 熟悉化学机械研磨CMP设备研磨和清洗原理，了解inline/offline工艺，
Be familiar with the principle of chemical mechanical polishing (CMP) equipment
polishing and cleaning，understand the inline/offline processes.
3. 具有一定项目管理能力；
Good project management ability;
4. 硕士或本科，理工科相关专业；
Master or bachelor degree, major in science &technology or mechanical;
5. 擅长沟通并能适应一定程度加班；
Good at communication and for overtime work to complete tasks on time.
6. 有先进工艺节点经验优先
Experience in advanced process technology is preferred.