KEY TASKS & RESPONSIBILITIES:
工作职责:
1.solve production line machine breakdowns/repairs make sure MTBF/MTTR meet target and no quality issue.及时维修设备确保MTBF/MTTR指标达成且无品质问题。
2.Define/optimize and arrange PM technicians perform preventive maintenance tasks according to PM plans. 制定/优化和安排PM技术员依据保养计划执行保养工作。
3. Analyze MTBF/MTTR performance and develop a continuous improvement plan. 分析MTBF/MTTR，并制定持续改进计划
4. Raise & follow up e-Capex for equipment setup and buyoff. 负责新购/转移设备的PR/PO 跟进和设备到厂后的setup & buyoff工作
5. Work with OEM/Supplier for quality issues & projects continue improvement.与OEM/供应商一起合作解决产线品质问题和持续项目改善。
6. Implement maintenance cost reduction/EHS projects. 落实维护成本降低项目和EHS项目改进
7.Equipment, tools, spare parts and consumables required apply/inventory control/maintenance.备件，工具的计划/维护和库存记录和库存控制和.
8.Identifies root cause of equipment, formulate effective corrective actions and resolves problems.确定设备相关的根本原因，制定有效的纠正措施并解决问题。
9.To implement tasks assigned by supervisor and support stakeholder department project. 执行上级分配的工作任务，支持合作部门的其他工作。
JOB REQUIREMENTS:
任职资格:
1. College degree or above, Mechanical Engineering or related engineering discipline with min 3 years working experience in high volume electronics manufacturing environment preferably semiconductor or camera module assembly.OSAT experience will be an advantage.专科以上学历，机械工程或相关工程专业，3年以上大型电子制造行业工作经验，半导体或摄像模组装配优先。有OSAT工作经验者优先考虑
2. At least 5 years of Back grinding, wafer saw, taping, mount process and equivalent work experience in related equipment (Disco, 6360, 6361, 6362 , DFL7160,DFG8560,DGP8760, DFM2700 platform). Good machine repair, maintenance, spare parts inventory control skills and personnel training skills. 至少5年以上Back grinding, wafer saw, taping, mount 工序相关设备（Disco, 6360, 6361, 6362, DFL7160,DFG8560,DGP8760, DFM2700 机型）工作经验。良好的机器维修，保养，备件库存控制技能和人员培训技能。
3. Good communication and teamwork skills, Logical analysis capabilities, Able to work independently and proactively in a fast-paced environment with multiple deadlines. 良好的沟通及团队协作能力,逻辑分析能力，能够在快节奏有多个截止日期的环境中独立主动地工作。
4. Good reading, speaking, and writing skills in English and Mandarin.良好的英语和普通话读，说，写能力。
5. Proficient in using office software such as Excel, Word, PPT, Ability to
solve practical problems using common software, such as SPC,FMEA,
8D reports, etc. 熟练使用办公软件,如Excel, Word，PPT,能够使用常用解决实际问题,SPC, FMEA, 8D报告等.
6. Knowledge in APQP, DOE, MSA, and Six Sigma will be an advantage.具备APQP, DOE, MSA和六西格玛知识者优先。
7.Comply with the leader’s arrangement, no bad habits.服从领导工作安排，无不良嗜好。