Senior/Principal Package Engineer

1. OVERALL RESPONSIBILITIES
The Senior / Principal Package Engineer will be responsible for defining, developing, and qualifying semiconductor and MEMS packaging solutions for new and existing products.
This is a key technical role within the organization. The successful candidate will be the primary internal expert for semiconductor packaging technologies and will play a central role in establishing packaging design guidelines, assembly flows, and qualification strategies.
The position involves close collaboration with IC design, product engineering, test engineering, manufacturing, and external OSAT partners to ensure robust, manufacturable, and cost-effective package solutions.
In addition to IC and MEMS packaging, the role will also support the development of compact electronic sensor modules integrating MEMS devices, PCBs, connectors, and mechanical housings.
The role offers the opportunity to contribute to the development of the company's packaging capabilities and to help establish future packaging platforms and engineering practices.
2. KEY RESPONSIBILITIES
Package Architecture & Design
•Define package architectures and select appropriate packaging technologies (QFN, BGA, WLP, SiP, fan-in/fan-out, flip-chip, MEMS cavity packages, etc.)
•Define package stack-ups, material selection, and mechanical constraints
•Develop package design rules and guidelines for IC and MEMS products
•Collaborate with IC designers and layout engineers on chip-package co-design
•Support design reviews and ensure packaging constraints are properly considered during product development
•Define architecture and integration concepts for compact sensor modules including MEMS devices, PCBs, connectors, and mechanical housings
Assembly Process Development
•Define assembly flows and process requirements with OSAT partners
•Develop and optimize processes such as die attach, wire bonding, flip-chip assembly, molding, plating, underfill, and singulation
•Identify manufacturability risks and implement design-for-manufacturability improvements
•Support yield improvement activities and troubleshooting during production ramp
•Support module-level assembly process definition including PCB integration, mechanical enclosure interface, and environmental robustness
New Product Introduction (NPI)
•Lead packaging activities from concept definition to mass production
•Coordinate packaging development with product engineering, reliability engineering, and manufacturing teams
•Support qualification builds and engineering samples
•Ensure smooth transition from development to volume production
•Lead packaging and module integration activities from concept to mass production
Reliability & Failure Analysis
•Define package qualification plans according to relevant standards (JEDEC, AEC-Q100 or customer requirements)
•Analyze reliability data and identify potential weaknesses in package design or assembly processes
•Coordinate failure analysis activities (X-ray, SAM, cross-sectioning, SEM/EDX, etc.)
•Implement corrective actions to ensure long-term product reliability
OSAT & Supplier Collaboration
•Work closely with OSAT partners to develop and qualify packaging processes
•Evaluate supplier capabilities and support technology assessments
•Participate in supplier audits and technical reviews when necessary
•Drive continuous improvement initiatives with strategic packaging partners
Technical Leadership & Documentation
•Act as the primary internal reference for semiconductor and MEMS packaging technologies
•Prepare technical specifications, design guidelines, and qualification reports
•Communicate technical risks, mitigation plans, and project status to management and stakeholders
•Contribute to the development of future packaging platforms and internal engineering standards
3. REQUIRED QUALIFICATIONS
Education
•B.S. in Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or a related discipline.
•M.S. or Ph.D. is preferred, particularly with focus on semiconductor or MEMS packaging
Experience
•5+ years of experience in semiconductor packaging, electronics assembly, or advanced manufacturing
•Demonstrated hands-on experience in package design, assembly processes, and reliability qualification
•Experience managing packaging development with OSAT partners
•Experience supporting NPI and production ramp activities
•Experience with MEMS or sensor packaging is strongly preferred
•Experience with sensor modules or electronic assemblies integrating MEMS devices and PCBs is a strong plus
4. TECHNICAL SKILLS
•Strong knowledge of semiconductor assembly technologies and materials
•Understanding of package reliability mechanisms and qualification methodologies
•Familiarity with thermo-mechanical and electrical simulation methodologies (ANSYS, Abaqus, COMSOL or equivalent)
•Experience with Design for Manufacturability (DFM) and Design for Reliability (DFR)
•Knowledge of statistical analysis and experimental methods (DOE, SPC) using tools such as JMP, Python or equivalent
•Understanding of mechanical enclosure interfaces, PCB integration constraints, and environmental robustness at module level
•basic understanding of semiconductor processes, and specifically MEMS
5. SOFT SKILLS
•Strong analytical and systematic problem-solving skills
•Ability to operate with a high level of technical autonomy
•Strong written and verbal communication skills
•Ability to work effectively across multidisciplinary teams
•Comfortable interacting with external suppliers and manufacturing partners
6. LANGUAGE REQUIREMENTS
•English required
•Chinese language skills are a plus but not mandatory
7. WORK ENVIRONMENT
The position may be based remotely or in a design center location.
Regular travel to manufacturing sites and OSAT partners will be required during development and qualification phases.