职位描述
MOLDING塑封半导体封装IGBT封装英语流利电子/半导体/集成电路
a. Requirements
1) University graduated major in Physics, Chemistry, mechanical engineering, Electronics engineering, material science, or equivalent
2) Min 3 years' experience in Discrete or Module semiconductor mold, trim and form process
3) Epoxy mold compound properties and its reliability failures knowledge
4) Trim/From mechanical design understanding against delamination, package crack and bent lead
5) JMP, Minitab DOE or other statistical analysis skill will get advantages
6) Be familiar with design, process FMEA, Control plan generation
7) In-depth knowledge of power electronic packages and processes
8) Fundamental understanding of package design and material properties
9) Knowledge of power packages processes
10) Understanding of semiconductor material properties and their influence on semiconductor device behavior
11) Able to understand thermo/mechanical simulation and JMP data analysis tools is strongly desired
12) Excellent interpersonal, verbal, and written English communication skills
13) Ability to demonstrate great attention to detail
14) Are a proven self-starter
b. Job description
1) Responsible from design review of new products, participate Package
and substrate(Lead frame and DBC) design review, optimize design, process characterization, generate related spec and work instruction, to be owner of qualification and customers samples to complete product qualification, initial training of operation
2) Lead potential failure modes review to define RPN into DFEMA and find counter measure to optimize design for yield, cost, quality, reliability, manufacturability, cycle time
3) Lead supplier to design required tools and jig such like mold die, trim/form dies, magazine, tubes, or tray
4) Characterize and generate report for mold , trim and from related failure modes and key parameters of output variables according to D/PFMEA
5) Optimize process recipe, parameters, tools, jigs to meet die attach cost, quality, yield, UPH, reliability, manufacturability to hands over to operation department
6) Validate design rule by process characterization
7) Generate process quality specs, recipe, D/PFMEA, Control plan, work instruction to train operation
8) Resolve technical issues from characterization, qualification, and customer samples
9) Owner of correspond process to meet required process success criteria
10) Generate new equipment PO spec leading cross functional team from operation and support department
1) University graduated major in Physics, Chemistry, mechanical engineering, Electronics engineering, material science, or equivalent
2) Min 3 years' experience in Discrete or Module semiconductor mold, trim and form process
3) Epoxy mold compound properties and its reliability failures knowledge
4) Trim/From mechanical design understanding against delamination, package crack and bent lead
5) JMP, Minitab DOE or other statistical analysis skill will get advantages
6) Be familiar with design, process FMEA, Control plan generation
7) In-depth knowledge of power electronic packages and processes
8) Fundamental understanding of package design and material properties
9) Knowledge of power packages processes
10) Understanding of semiconductor material properties and their influence on semiconductor device behavior
11) Able to understand thermo/mechanical simulation and JMP data analysis tools is strongly desired
12) Excellent interpersonal, verbal, and written English communication skills
13) Ability to demonstrate great attention to detail
14) Are a proven self-starter
b. Job description
1) Responsible from design review of new products, participate Package
and substrate(Lead frame and DBC) design review, optimize design, process characterization, generate related spec and work instruction, to be owner of qualification and customers samples to complete product qualification, initial training of operation
2) Lead potential failure modes review to define RPN into DFEMA and find counter measure to optimize design for yield, cost, quality, reliability, manufacturability, cycle time
3) Lead supplier to design required tools and jig such like mold die, trim/form dies, magazine, tubes, or tray
4) Characterize and generate report for mold , trim and from related failure modes and key parameters of output variables according to D/PFMEA
5) Optimize process recipe, parameters, tools, jigs to meet die attach cost, quality, yield, UPH, reliability, manufacturability to hands over to operation department
6) Validate design rule by process characterization
7) Generate process quality specs, recipe, D/PFMEA, Control plan, work instruction to train operation
8) Resolve technical issues from characterization, qualification, and customer samples
9) Owner of correspond process to meet required process success criteria
10) Generate new equipment PO spec leading cross functional team from operation and support department
职位福利：五险一金、年底双薪、包吃、包住、带薪年假、免费停车、周末双休、免费班车
职位亮点：海外IGBT封装研发团队，Molding
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