干法刻蚀工艺研发工程师

职位描述:

1. 了解干法刻蚀工艺基本原理，能够建立并优化工艺参数进行刻蚀工艺研发。如期完成刻蚀相关研发项目，满足项目需求。

2. 了解干法刻蚀机的机台组成，并能熟练操作刻蚀机完成晶圆刻蚀

3. 能够熟练使用CDSEM, OCD, AFM, THK等量测机台进行刻蚀的特征尺寸数据收集，并且具备分析整理数据的能力。

4. 了解半导体制造工艺，配合工艺整合部门完成工艺器件电学性能和可靠性验证。

5. 了解刻蚀制成后各种缺陷的种类及控制方法。

6. 了解半导体器件工作原理，并对刻蚀行为与半导体器件性能的关系有一定了解。



Job Description:

1. Understand the basic principles of dry etching process, and be able to establish and optimize process parameters for etching process research and development. Complete the etching-related research and development projects on schedule to meet the project requirements;

2. Understand the composition of the dry etching tool, and be able to operate the etching tool to complete wafer etching;

3. Able to use CDSEM, OCD, AFM, THK and other measuring machines to collect etched feature size data, and have the ability to analyze and organize data;

4. Understand the semiconductor manufacturing process and cooperate with the process integration department to complete the electrical performance and reliability verification of process devices.

5. Understand the types and control methods of various defects after etching；

6. Understand the working principle of semiconductor devices, and have a certain understanding of the relationship between etching behavior and semiconductor device performanc

任职要求：



1. 大学本科或以上学历，理工科专业；

2. 英语四级及以上，熟练使用office办公软件；

3. 熟悉干法刻蚀工艺，了解等离子体刻蚀各类机台工作原理，了解半导体制成工艺流程。

4. 具有良好的沟通协调技巧，抗压能力强，服从部门管理，为人正直。

Job Qualifications：

1. Bachelor degree or above, major in science and engineering;

2. CET-4 and above, proficient in using office software;

3. Familiar with dry etching process, understand the working principle of various plasma etching machines, and understand the process flow of semiconductor manufacturing;

4. Have good communication and coordination skills, strong ability to withstand pressure, obey department management, and be upright.