封装技术研发经理

Summary:
1. New package technology development
2. Path-finding for new package related process flow
3. Lead new package material study and qualification.
RESPONSIBILITIES:
1. Lead a team to develop new package technology and related process flow.
2. Survey new material to make package more reliable, more robust and competitive.
3. Work with assembly house and material vendor to develop and qualify the new materials and
new package.
4. Coordinates the qualification of new materials, package, assembly processes, and drive the
evaluation for supplier current process and material change.
5. Qualify new supplier and develop current supplier capability and manage supplier
relationship.
6. Sum up the experience of Package process, SMT process and maintain/update the
assembly baseline.
7. Perform other tasks assigned by supervisor.
REQUIREMENTS:
1. Intensive hands-on experience on package technology and process development.
2. Be proficient in different processes of package, such as wafer grinding, wafer saw, die attach,
flip chip die attach, plasma clean, wire bond, molding process, laser ablation, laser marking
process, and etc.
3. Bachelor/master’s degree with 10+ years directly related experience, or Doctor degree with
5+ related experience.
4. Sufficient knowledge about semiconductor supply chain, be familiar with assembly sub-con,
package BOM vendor.
5. Fluent oral and written English is required.
6. Have machine maintenance knowledge is a plus.
7. Work proactively.
KEY WORDS:
Package technology and process development, New Package/structure process flow research,
Package material sourcing/study/qualification, Package process NDI.